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Description
DDR CL2~3 small outline memory modules, currently the module density is available from 128MB to 2GB. It consists DDR Synchronous DRAM in TSOP packages.
The memory module intent for mounting into 200 pins edge connector sockets. The electrical and mechanical specifications are as follows : |
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Features
- DDRSPEED GRADE : 266MBPS,333MBPS, 400MBPS
- SO-DIMM : 200-PIN
- PCB HEIGHT : 1.181 INCH
- MEMORY ORGANIZATION : X8 , X16 TSOP DRAM CHIP
- JEDEC STANDARD
- CAS LATENCY : 3,4
- VDD VOLTAGE : 2.5+_0.1V
- VDDQ VOLTAGE : 2.5+_0.1V
- SERIAL PRESENCE DETECT WITH EEPROM
- ROHS COMPLIANT
- APPLICATION : NOTEBOOK
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