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Description
DDRIII CL7 small outline memory modules, currently the module density is available from 1GB to 2GB. It consists DDRIII Synchronous DRAM in FBGA packages.
The memory module intent for mounting into 240 pins edge connector sockets. The electrical and mechanical specifications are as follows : |
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Features
- DDRIII SPEED GRADE : 1066MBPS,1333MBPS
- LONG-DIMM : 240-PIN
- PCB HEIGHT : 1.181 INCH
- MEMORY ORGANIZATION : X8 , X16 FBGA DRAM CHIP
- DDRIII DRAM INTERFACE: SSTL_18
- JEDEC STANDARD
- CAS LATENCY : 7-7-7-21
- VDD VOLTAGE : 1.5+_0.1V
- VDDQ VOLTAGE : 1.5+_0.1V
- SERIAL PRESENCE DETECT WITH EEPROM
- ROHS COMPLIANT
- APPLICATION : DESKTOP
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